Ruiqi Lim, E. L. Tan, K. Tan, Weiguo Chen, Ramona B. Damalerio, Ming-Yuan Cheng
{"title":"Silicon cap structure development and microassembly for forward tactile sensing in endovascular guidewire intervention","authors":"Ruiqi Lim, E. L. Tan, K. Tan, Weiguo Chen, Ramona B. Damalerio, Ming-Yuan Cheng","doi":"10.1109/EPTC.2015.7412324","DOIUrl":null,"url":null,"abstract":"Guidewire procedure for peripheral artery disease treatment is heavily dependent on the surgeon's skills and experiences. In order to reduce such dependency, sensor-enhanced forward sensing guidewire is proposed. In this paper, we proposed a silicon cap structure that increases the robustness and efficient force transfer of the existing sensor-enhanced forward sensing guidewire. Silicon cap structure of 0.32 × 0.32 × 0.40mm has been fabricated using two masks process. Assembly of silicon structure with sensor having a 30μm overloading protection limit and resistance changes of 25kΩ with applied force ranging from 0∼40mN has been demonstrated.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412324","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Guidewire procedure for peripheral artery disease treatment is heavily dependent on the surgeon's skills and experiences. In order to reduce such dependency, sensor-enhanced forward sensing guidewire is proposed. In this paper, we proposed a silicon cap structure that increases the robustness and efficient force transfer of the existing sensor-enhanced forward sensing guidewire. Silicon cap structure of 0.32 × 0.32 × 0.40mm has been fabricated using two masks process. Assembly of silicon structure with sensor having a 30μm overloading protection limit and resistance changes of 25kΩ with applied force ranging from 0∼40mN has been demonstrated.