Evaluation of plastic package delamination via reliability testing and fracture mechanics approach

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI:10.1109/ECTC.1997.606206

V. Holalkere, S. Mirano, A. Kuo, W.T. Chen, C. Sumithpibul, S. Sirinorakul

引用次数: 13

Abstract

Material delamination is a commonly encountered reliability problem with plastic surface mount devices. This paper describes a systematic procedure to assess plastic package delamination. In this procedure, the JEDEC reliability tests (EIA/JESD22-A112-A and A113-A), the finite element stress analysis, and the fracture mechanics theory are integrated together for evaluation of the moisture sensitivity of plastic IC packages.

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用可靠性试验和断裂力学方法评价塑料包装的分层

材料分层是塑料表面贴装器件常见的可靠性问题。本文描述了一个评估塑料包装分层的系统程序。在此过程中，将JEDEC可靠性试验(EIA/JESD22-A112-A和A113-A)、有限元应力分析和断裂力学理论相结合，对塑料IC封装的湿敏感性进行了评价。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

1997 Proceedings 47th Electronic Components and Technology Conference

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