Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects

Abstract

Novel nonconductive adhesives/films (NCAs/NCFs) with carbon nanotubes (CNTs) for high performance interconnects were developed. A small amount of CNTs (0.03 wt%) was dispersed into the NCAs/NCFs to increase the thermal conductivities and at the same time to decrease the coefficient of thermal expansion (CTE) for high thermo-mechanical reliability of the NCAs/NCFs interconnect joints. The thermal mechanical analyzer measurements showed that the CTE value of the 0.03 wt% CNTs filled NCAs/NCFs was significantly decreased. Current-voltage characterizations showed that the current carrying capabilities of the CNTs (0.03 wt%) filled NCAs/NCFs were increased 14% comparing to the unfilled NCAs/NCFs due to the more efficient thermal dissipation.