Laser hybrid integration on silicon photonic integrated circuits with reflected grating

Yu Sun, Man Zhao, Juan Wei, Fengman Liu, H. Xue, Huimin He, Liqiang Cao
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Abstract

For high-density, broadband, and low power consumption interconnect, the flip-chip silicon photonic integrated circuits (PIC) is a promising package structure which makes the signal path shorter, and reduces losses and power. A back injecting reflected grating which makes light couple from backside of the PIC is designed and simulated. A laser diode (LD) hybrid integration scheme on a silicon PIC is design and simulated. The simulated efficiency of LD coupling into the waveguide through reflected grating is 42.55%. The light output from the proposed grating to fiber is also designed and simulated. The coupling efficiency is 38.02%, the coupling loss is 4. 2dB.
带有反射光栅的硅光子集成电路的激光混合集成
对于高密度、宽带和低功耗的互连,倒装硅光子集成电路(PIC)是一种很有前途的封装结构,它可以缩短信号通路,降低损耗和功耗。设计并仿真了一种从PIC背面进行光耦合的后注入反射光栅。设计并仿真了一种基于硅PIC的激光二极管混合集成方案。仿真结果表明,LD通过反射光栅耦合到波导中的效率为42.55%。设计并模拟了光栅到光纤的光输出。耦合效率为38.02%,耦合损失为4。2 db。
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