Electrical overstress of nonencapsulated aluminum bond wires

Abstract

Electrical overstress of nonencapsulated aluminum bond wires is studied by several methods. Time-to-failure experiments, strobe microphotography, and thermal finite-element modeling are used to examine the overstress process. Computer simulations then provide approximate solutions to a more general case. Failure analysts may use these results to estimate overstress current and duration from physical evidence.<>