Yunhan Chen, E. Ng, D. D. Shin, C. Ahn, Yushi Yang, I. Flader, V. Hong, T. Kenny
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引用次数: 30
Abstract
This work demonstrates, for the first time, ovenization of a fully-encapsulated dual-mode silicon MEMS resonator operational over a large ambient temperature range. We maintain a localized, elevated operating temperature by utilizing the temperature coefficient of frequency (TCf) difference between two excitation modes of the same resonant body as a thermometer, and by integrating a micro-oven in the encapsulation layer. Preliminary results of real-time compensation demonstrate a stability of ±250ppb of the in-plane Lamé-mode frequency over -20°C to 80°C.