Transistor reliability characterization and comparisons for a 14 nm tri-gate technology optimized for System-on-Chip and foundry platforms

C. Prasad, K. Park, M. Chahal, I. Meric, S. Novak, S. Ramey, P. Bai, H. Chang, N. Dias, W. Hafez, C. Jan, N. Nidhi, R. Olac-vaw, R. Ramaswamy, C. Tsai
{"title":"Transistor reliability characterization and comparisons for a 14 nm tri-gate technology optimized for System-on-Chip and foundry platforms","authors":"C. Prasad, K. Park, M. Chahal, I. Meric, S. Novak, S. Ramey, P. Bai, H. Chang, N. Dias, W. Hafez, C. Jan, N. Nidhi, R. Olac-vaw, R. Ramaswamy, C. Tsai","doi":"10.1109/IRPS.2016.7574536","DOIUrl":null,"url":null,"abstract":"The transistor reliability characterization of a 14nm System-on-Chip (SoC) node optimized for low power operation is described. In-depth assessments of reliability and performance for Core and I/O devices are performed on Logic and SoC nodes, and clear trends with scaling are identified. Insight is provided into hot carrier and off-state aging, and self-heat effects. Technological advancements across process nodes demonstrate the ability to achieve matched or improved reliability in conjunction with robust generational performance gains. The 14nm SoC node is shown to be robust for all transistor reliability modes. Process monitor data are used to demonstrate the stability of the production line in high-volume manufacturing.","PeriodicalId":172129,"journal":{"name":"2016 IEEE International Reliability Physics Symposium (IRPS)","volume":"179 40","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.2016.7574536","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21

Abstract

The transistor reliability characterization of a 14nm System-on-Chip (SoC) node optimized for low power operation is described. In-depth assessments of reliability and performance for Core and I/O devices are performed on Logic and SoC nodes, and clear trends with scaling are identified. Insight is provided into hot carrier and off-state aging, and self-heat effects. Technological advancements across process nodes demonstrate the ability to achieve matched or improved reliability in conjunction with robust generational performance gains. The 14nm SoC node is shown to be robust for all transistor reliability modes. Process monitor data are used to demonstrate the stability of the production line in high-volume manufacturing.
针对片上系统和代工平台优化的14nm三栅极技术的晶体管可靠性表征和比较
描述了针对低功耗运行优化的14nm片上系统(SoC)节点的晶体管可靠性特性。在逻辑和SoC节点上对核心和I/O设备的可靠性和性能进行了深入评估,并确定了扩展的明确趋势。洞察提供了热载体和非状态老化,和自热效应。跨流程节点的技术进步证明了实现匹配的或改进的可靠性以及健壮的分代性能增益的能力。14nm SoC节点对所有晶体管可靠性模式都具有鲁棒性。过程监控数据用于展示大批量生产中生产线的稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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