Atmospheric neutron effects in advanced microelectronics, standards and applications

J. Leray, J. Baggio, V. Ferlet-Cavrois, O. Flament
{"title":"Atmospheric neutron effects in advanced microelectronics, standards and applications","authors":"J. Leray, J. Baggio, V. Ferlet-Cavrois, O. Flament","doi":"10.1109/ICICDT.2004.1309974","DOIUrl":null,"url":null,"abstract":"Since the 80s it is known that Terrestrial Cosmic Rays, mainly reported as Atmospheric Neutrons, can penetrate the natural shielding of buildings, equipments and circuit package and induce Soft Errors in integrated circuits and Breakdown of power devices. The high-energy neutron fluxes of interest range between 10 particles/cm/sup 2//hour at sea level and 10/sup 4/ particles/cm/sup 2//hour at typical airplanes flight altitude of 30000 feet, with modulation due to Solar Flares. In the 90s the phenomenon has pervaded as a consequence of the roadmap of electronic devices, especially downscaling of design rules, increase of signal bandwidth and increase of the size of DRAM and SRAM memory, standalone or embedded on processors and System-on-Chips. Failure-In-Time and Soft Error Rate became unacceptable. Test Standards and design solutions have been proposed to maintain reliability of commercial products and improve those used in special such as avionic computers. The paper describes the Atmospheric Neutron flux, the effects in the main classes of devices and specific cases such as neutron-induced single event upset observed in CMOS vs. CMOS/SOI and some mitigation issues. A model called CCPM (Critical Cross-Point Model) is proposed to provide critical graphs of technology node sensitivity along the scaling trend of CMOS.","PeriodicalId":158994,"journal":{"name":"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)","volume":"85 ","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2004.1309974","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14

Abstract

Since the 80s it is known that Terrestrial Cosmic Rays, mainly reported as Atmospheric Neutrons, can penetrate the natural shielding of buildings, equipments and circuit package and induce Soft Errors in integrated circuits and Breakdown of power devices. The high-energy neutron fluxes of interest range between 10 particles/cm/sup 2//hour at sea level and 10/sup 4/ particles/cm/sup 2//hour at typical airplanes flight altitude of 30000 feet, with modulation due to Solar Flares. In the 90s the phenomenon has pervaded as a consequence of the roadmap of electronic devices, especially downscaling of design rules, increase of signal bandwidth and increase of the size of DRAM and SRAM memory, standalone or embedded on processors and System-on-Chips. Failure-In-Time and Soft Error Rate became unacceptable. Test Standards and design solutions have been proposed to maintain reliability of commercial products and improve those used in special such as avionic computers. The paper describes the Atmospheric Neutron flux, the effects in the main classes of devices and specific cases such as neutron-induced single event upset observed in CMOS vs. CMOS/SOI and some mitigation issues. A model called CCPM (Critical Cross-Point Model) is proposed to provide critical graphs of technology node sensitivity along the scaling trend of CMOS.
大气中子效应在先进微电子中的应用
自80年代以来,地球宇宙射线(主要报道为大气中子)可以穿透建筑物、设备和电路封装的自然屏蔽,引起集成电路的软误差和电力器件的击穿。所研究的高能中子通量在海平面上为10粒子/厘米/sup 2/小时,在典型的飞机飞行高度为30000英尺时为10/sup 4/粒子/厘米/sup 2/小时,由于太阳耀斑的调制。在90年代,随着电子设备的发展,特别是设计规则的缩小,信号带宽的增加以及DRAM和SRAM存储器尺寸的增加,这种现象已经普遍存在,无论是独立的还是嵌入处理器和片上系统的。及时故障和软错误率变得不可接受。已经提出了测试标准和设计解决方案,以保持商业产品的可靠性,并改进用于特殊用途的产品,如航空电子计算机。本文介绍了大气中子通量、主要器件类别的影响以及在CMOS与CMOS/SOI中观测到的中子诱导单事件扰动等具体情况以及一些缓解问题。提出了一个临界交叉点模型(Critical Cross-Point model, CCPM),以提供沿CMOS缩放趋势的技术节点灵敏度的临界图。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信