Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.

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Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - 最新文献

Membrane-mediated electropolishing of damascene copper

Pub Date : 2005-06-06 DOI: 10.1109/IITC.2005.1499983 S. Mazur, C. E. Jackson, G. W. Foggin

Wafer-level microfluidic cooling interconnects for GSI

Pub Date : 2005-06-06 DOI: 10.1109/IITC.2005.1499971 Bing Dang, P. Joseph, M. Bakir, T. Spencer, P. Kohl, J. Meindl

Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics

Pub Date : 2005-06-06 DOI: 10.1109/IITC.2005.1499934 R. Hoofman, J. Michelon, P. Bancken, R. Daamen, G. Verheijden, V. Arnal, O. Hinsinger, L. Gosset, A. Humbert, W. Besling, C. Goldberg, R. Fox, L. Michaelson, C. Guedj, J. Guillaumond, V. Jousseaume, L. Arnaud, D. Gravesteijn, J. Torres, G. Passemard

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