Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.

查看最新文献

987

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - 最新文献

Membrane-mediated electropolishing of damascene copper

Pub Date : 2005-06-06 DOI: 10.1109/IITC.2005.1499983 S. Mazur, C. E. Jackson, G. W. Foggin

Wafer-level microfluidic cooling interconnects for GSI

Pub Date : 2005-06-06 DOI: 10.1109/IITC.2005.1499971 Bing Dang, P. Joseph, M. Bakir, T. Spencer, P. Kohl, J. Meindl

Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics

Pub Date : 2005-06-06 DOI: 10.1109/IITC.2005.1499934 R. Hoofman, J. Michelon, P. Bancken, R. Daamen, G. Verheijden, V. Arnal, O. Hinsinger, L. Gosset, A. Humbert, W. Besling, C. Goldberg, R. Fox, L. Michaelson, C. Guedj, J. Guillaumond, V. Jousseaume, L. Arnaud, D. Gravesteijn, J. Torres, G. Passemard

查看全部

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。