Membrane-mediated electropolishing of damascene copper

S. Mazur, C. E. Jackson, G. W. Foggin
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引用次数: 2

Abstract

Membrane-mediated electropolishing is a new process whereby a metal substrate is anodically oxidized in de-ionized water and the metal ions migrate across a charge-selective membrane to the cathode. All metal ions removed from the substrate are plated onto the cathode. In contrast with both CMP and electrochemical mechanical polishing the substrate is never exposed to abrasives or electrolytes, no reagents are consumed, no waste is generated and no post-cleaning is required. High removal rates and planarization efficiencies are achieved with low mechanical forces.
大马士革铜的膜介质电抛光
膜介质电抛光是一种新的工艺,其中金属衬底在去离子水中阳极氧化,金属离子通过电荷选择膜迁移到阴极。从衬底上除去的所有金属离子都被镀到阴极上。与CMP和电化学机械抛光相比,基材从不接触磨料或电解质,不消耗试剂,不产生废物,也不需要后清洗。在机械力较低的情况下,实现了高的去除率和平化效率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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