2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

查看最新文献

837

2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - 最新文献

Recent advances in low temperature process in view of 3D VLSI integration

Pub Date : 2016-10-01 DOI: 10.1109/S3S.2016.7804404 C. Fenouillet-Béranger, P. Batude, L. Brunet, V. Mazzocchi, C-M. V. Lu, F. Deprat, J. Micout, M.-P. Samson, B. Previtali, P. Besombes, N. Rambal, V. Lapras, F. Andrieu, O. Billoint, M. Brocard, S. Thuries, G. Cibrario, P. Acosta-Alba, B. Mathieu, S. Kerdilès, F. Nemouchi, C. Arvet, P. Besson, V. Loup, R. Gassilloud, X. Garros, C. Leroux, V. Beugin, C. Guérin, D. Benoit, L. Pasini, J. Hartmann, M. Vinet

Charge plasma based partial-ground-plane-MOSFET on selective buried oxide (SELBOX)

Pub Date : 2016-10-01 DOI: 10.1109/S3S.2016.7804385 F. Bashir, S. Loan, Asim M. Murshid, A. Alamoud

High density SRAM bitcell architecture in 3D sequential CoolCube™ 14nm technology

Pub Date : 2016-10-01 DOI: 10.1109/S3S.2016.7804376 M. Brocard, R. Boumchedda, J. Noel, K. Akyel, B. Giraud, E. Beigné, D. Turgis, S. Thuries, G. Berhault, O. Billoint

查看全部

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。