Shen-Chun Wu, J. Peng, Shih-Ru Lai, C. Yeh, Yau‐Ming Chen
{"title":"平板蒸发器环形热管热泄漏影响的研究","authors":"Shen-Chun Wu, J. Peng, Shih-Ru Lai, C. Yeh, Yau‐Ming Chen","doi":"10.1109/IMPACT.2009.5382188","DOIUrl":null,"url":null,"abstract":"Loop heat pipes (LHPs) have a great potential for applications of electronic cooling due to the advantages of high transfer capacity, low thermal resistance and long transport distances.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"22 1","pages":"348-351"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Investigation of the effect of heat leak in loop heat pipes with flat evaporator\",\"authors\":\"Shen-Chun Wu, J. Peng, Shih-Ru Lai, C. Yeh, Yau‐Ming Chen\",\"doi\":\"10.1109/IMPACT.2009.5382188\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Loop heat pipes (LHPs) have a great potential for applications of electronic cooling due to the advantages of high transfer capacity, low thermal resistance and long transport distances.\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"22 1\",\"pages\":\"348-351\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382188\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382188","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation of the effect of heat leak in loop heat pipes with flat evaporator
Loop heat pipes (LHPs) have a great potential for applications of electronic cooling due to the advantages of high transfer capacity, low thermal resistance and long transport distances.