集成高频电容器用BaSrTiO/ sub3 /薄膜

G. Stauf, S. Bilodeau, R. Watts
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引用次数: 11

摘要

复合氧化物介电Ba/sub - 1-x/Sr/sub -x/ TiO/sub - 3/ (BST)最近在DRAM应用中得到了广泛的研究。BST可能适合的另一个近期重要应用是取代目前附加在高级集成电路上的分立电容器。具体器件包括旁路、去耦和开关滤波电容器,通常在高频下工作。对于目前基于SiO/sub /的电介质,这种集成电容器可能占器件面积的20%至50%;使用更高的介电常数BST可以将其降低至少10倍。我们将讨论mocvd生长的BST与这些电容器应用相关的特性,包括二阶介电非线性和有用器件工作电压(3 V)下的泄漏电流。介电常数、非线性和击穿电压与BST薄膜的沉积温度有很强的相关性,因此最佳加工条件将取决于终端器件应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
BaSrTiO/sub 3/ thin films for integrated high frequency capacitors
The complex oxide dielectric Ba/sub 1-x/Sr/sub x/TiO/sub 3/ (BST) has recently been studied intensively for DRAM applications. Another significant nearer term application for which BST may be suited is replacement of discrete capacitors now attached to advanced IC's. Specific devices include bypass, decoupling, and switched filter capacitors, often operated at high frequencies. With current SiO/sub 2/ based dielectrics such integrated capacitors may take up from 20% to 50% of the device area; use of higher dielectric constant BST could reduce this by at least a factor of 10. We will discuss properties of MOCVD-grown BST which relate to these capacitor applications, including second order dielectric nonlinearity and leakage currents at useful device operating voltages (3 V). Dielectric constant, nonlinearity and breakdown voltages are found to have a strong dependence on deposition temperature of BST films, so optimum processing conditions will depend on the end device application.
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