1U和2U系统服务器和存储产品的散热设计策略

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382250

B. Chang, C. Hsiao, Ping-Chi Hung, C. T. Wang

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引用次数: 0

摘要

本文通过数值模拟的方法讨论了舰载布置、隔离、冗余设计和出口条件四个方面的问题。对1U和2U系统分别进行了200W和700W的仿真。本文还针对每个问题给出了一些解决方案，并揭示了这两个系统中的热现象。适当的放置可以减少热设计的负荷，使设计更容易。在1U系统中，隔离的影响是重要的，它将限制CPU冷却器的热性能。对于冗余设计，由于再流动，流场可能会很复杂。出口条件也会影响热工性能，文中还提出了其他可能的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal design strategy of server and storage products for 1U and 2U system

There are four topics have been discussed in this paper via numerical simulation which include on board placement, stand-off, redundancy design and outlet condition. The simulation is performed for 1U with 200W and 2U system with 700W, respectively. This paper also provides the some solutions for each topic and reveals the thermal phenomena in these two systems. The proper placement can reduce the loading of thermal design, and it will make the design easier. The effect of stand-off is important in 1U system and will limited to the thermal performance of CPU cooler. For redundancy design, the flow field may be complex due to re-flow. The outlet condition will also affect the thermal performance, the other possible solutions have been mentioned in this paper.

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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