化学镀中可设计合金涂层的新策略

Guixin Dai, Shiping Wu, Xixi Huang, Xiaodong Zhang, Ming-jie Wang
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引用次数: 2

摘要

提出了一种al诱导化学镀与热扩散相结合制备可设计合金涂层的新策略。在此基础上,采用铝致化学镀法制备了多层镀层。采用热扩散对多层涂层进行合金化,形成合金涂层。该技术可以解决化学镀中合金镀层的设计问题。对于可设计的合金涂层,制备了多层涂层作为基础材料。因此,对多层涂层的制备方法和可能性进行了初步探讨。然而,多层涂层是通过热扩散合金化。化学镀的涂层要求能适应高温。本文讨论了满足这一条件的涂料的制备方法。结果表明,铝致化学镀结合热扩散制备可设计合金镀层的方法是可行的。铝致化学镀制备的涂层适合热扩散。在沉积过程中,多层镀层的形成是按照金属活性的先后顺序进行的。最后,根据制备方法成功制备了设计的合金涂层。因此,这是一种很有前途的方法,可以克服在化学镀领域和微晶格材料的成分设计中创建可设计的合金涂层的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel strategy for designable alloy coatings in electroless plating
ABSTRACT A novel strategy for the preparation of designable alloy coatings by Al-induced electroless plating combined with thermal diffusion was proposed in the paper. Based on the method, Al-induced electroless plating was used to create multilayer coatings. Thermal diffusion is used to alloy the multilayer coatings to form alloy coatings. This technique can resolve the design problem of alloy coatings in electroless plating. For designable alloy coatings, multilayer coatings were prepared as the basic materials. Thus, the preparation possibility and procedure of multilayer coatings were investigated primarily. However, the multilayer coatings were alloyed by thermal diffusion. The coatings of electroless plating were required to accommodate high temperatures. The preparation methods for coatings have been discussed in this paper to satisfy this condition. The results show that the preparation method of designable alloy coatings by Al-induced electroless plating combined with thermal diffusion is feasible. The coatings prepared by Al-induced electroless plating were suitable for thermal diffusion. During the deposition process, the multilayer coatings were produced in the order of metal activity. Finally, the designed alloy coatings were successfully formed based on the preparation method. Thus, this is a promising approach to overcome the challenges of creating designable alloy coatings in the field of electroless plating and in the composition design of microlattice materials.
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