Transactions of the IMF

Investigation of impurity ions on the influence of copper electrodeposition in through holes of printed circuit board

Pub Date : 2025-07-02 DOI: 10.1080/00202967.2025.2517442 Xian‐Ming Chen, Wei He, Benxia Huang, Hongbin Cui, Weibin Zhou, Kaijian Cai, Wanjin Wang, Guoqin Chen, Shouxu Wang, Yuanming Chen

Effects of 2-aminothiazoline and benzotriazole on copper foil etching

Pub Date : 2025-04-10 DOI: 10.1080/00202967.2025.2485551 Lei Jin, Ke Li, Zhao-Yun Wang

Production of superhydrophobic surfaces on hydrophilic AA 6063 aluminium alloy and optimisation using a Taguchi design approach

Pub Date : 2024-08-30 DOI: 10.1080/00202967.2024.2388356 Cetin Karagol, Sahra Dandil, Caglayan Acikgoz