{"title":"建模网络处理器和包的电力传输分析","authors":"W. Cui, P. Parmar, J. Morgan, U. Sheth","doi":"10.1109/ISEMC.2005.1513612","DOIUrl":null,"url":null,"abstract":"The method of power delivery analysis on a network processor and package design is presented. A current profile was developed from the processor design and validated by the measurements. Distributed current sources were used to model the transient current drawn by the silicon. To model the package correctly, distributed circuit elements were used. The sensitivity of the voltage droop to the current stimulus was studied in order to design the appropriate current ramping steps. Two current profiles were studied with measurements to improve the processor design for power integrity.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"24 1","pages":"690-694 Vol. 3"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Modeling the network processor and package for power delivery analysis\",\"authors\":\"W. Cui, P. Parmar, J. Morgan, U. Sheth\",\"doi\":\"10.1109/ISEMC.2005.1513612\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The method of power delivery analysis on a network processor and package design is presented. A current profile was developed from the processor design and validated by the measurements. Distributed current sources were used to model the transient current drawn by the silicon. To model the package correctly, distributed circuit elements were used. The sensitivity of the voltage droop to the current stimulus was studied in order to design the appropriate current ramping steps. Two current profiles were studied with measurements to improve the processor design for power integrity.\",\"PeriodicalId\":6459,\"journal\":{\"name\":\"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.\",\"volume\":\"24 1\",\"pages\":\"690-694 Vol. 3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2005.1513612\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2005.1513612","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling the network processor and package for power delivery analysis
The method of power delivery analysis on a network processor and package design is presented. A current profile was developed from the processor design and validated by the measurements. Distributed current sources were used to model the transient current drawn by the silicon. To model the package correctly, distributed circuit elements were used. The sensitivity of the voltage droop to the current stimulus was studied in order to design the appropriate current ramping steps. Two current profiles were studied with measurements to improve the processor design for power integrity.
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