硅衬底AlN缓冲层Al0.68Sc0.32N表面声波谐振器的高耦合系数谐振模式

Zichen Tang, Michael D’Agati, R. Olsson
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引用次数: 1

摘要

我们报道了在硅衬底上具有氮化铝缓冲层的氮化铝(AlN)表面声波(SAW)谐振器中具有高机电耦合系数(kt 2)的谐振模式。我们证明了电极材料、电极厚度、AlScN厚度和器件方向对kt 2的影响。我们利用本研究的优化参数,在CMOS兼容的制造工艺中实现了SAW器件,测量到的kt 2高达4.78%,这是在低成本单晶硅衬底上报道的AlScN SAW器件的高值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High Coupling Coefficient Resonance Mode in Al0.68Sc0.32N Surface Acoustic Wave Resonator with AlN Buffer Layer on a Silicon Substrate
We report on a resonance mode with high electro-mechanical coupling coefficient (kt 2) in an Aluminum Scandium Nitride (AlScN) Surface Acoustic Wave (SAW) resonator with an Aluminum Nitride (AlN) buffer layer on a silicon substrate. We demonstrate the influence of electrode material, electrode thickness, AlScN thickness, and device orientation on the kt 2. We utilize the optimized parameters from this study to realize SAW devices in a CMOS compatible fabrication process and measured a kt 2 as high as 4.78%, which is a high value for AlScN SAW devices reported on low cost single crystal silicon substrates.
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