利用挥发性材料的先进气隙形成方案

2021 IEEE International Interconnect Technology Conference (IITC) Pub Date : 2021-07-06 DOI:10.1109/IITC51362.2021.9537549

H. Warashina, H. Kawasaki, H. Nagai, T. Yamaguchi, N. Sato, Y. Kikuchi, X. Sun

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引用次数: 5

摘要

为了解决BEOL互连的RC延迟问题，我们提出了一种新的气隙形成方案。该方案使用挥发性材料(VM)，并允许我们省略一个光刻步骤，这是传统气隙形成所需的。该方案也可以应用于减法互连方案。在本研究中，我们将介绍虚拟机的基本特性，并通过电子测试演示新型气隙集成。

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Advanced Air Gap Formation Scheme Using Volatile Material

As a solution for RC delay of BEOL interconnect, we developed a novel air gap formation scheme. This scheme uses a volatile material (VM) and allows us to omit one lithography step, which was required for conventional air gap formation. It is possible to apply this scheme to subtractive interconnect scheme too. In this study, we will introduce the basic characteristics of VM and demonstrate the novel air gap integration through e-tests.

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2021 IEEE International Interconnect Technology Conference (IITC)

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