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引用次数: 1
摘要
III-V化合物半导体具有比Si更高的电子迁移率和更低的有效质量,有望成为后Si通道材料。实际上,具有高k栅极电介质的InGaAs mosfet的高性能已经被证明[1,2]。另一方面,由于电子传递的准弹道行为,与传统的si- mosfet相比,III-V沟道mosfet可能更容易受到量子力学效应(如量子反射和隧道效应)的影响。在本文中,我们使用WMC (Wigner Monte Carlo)模拟来研究III-V沟道mosfet中的量子输运效应[3,4],该模拟可以充分考虑量子输运效应。结果发现,即使通道长度大于10 nm,量子反射也会降低导通电流,而源漏直接隧穿会增加亚阈值电流。
Quantum transport simulation of III–V MOSFETs based on Wigner Monte Carlo approach
III-V compound semiconductors are expected as a post-Si channel material, because they have higher electron mobility and lower effective mass than Si. Actually, the high performance of InGaAs MOSFETs with high-k gate dielectrics has been demonstrated [1,2]. On the other hand, due to a quasi-ballistic behavior of electron transport, III-V channel MOSFETs may be more vulnerable by quantum mechanical effects such as quantum reflection and tunneling, as compared to conventional Si-MOSFETs. In this paper, we investigate quantum transport effects in III-V channel MOSFETs by using a Wigner Monte Carlo (WMC) simulation [3,4], which can fully incorporate the quantum transport effects. As a result, we found that the quantum reflection reduces on-current, while the source-drain (SD) direct tunneling increases subthreshold current even as the channel length is larger than 10 nm.