毫米波系统集成封装天线性能分析与测试解决方案

Sheng-Chi Hsieh, Cheng-Yu Ho, Chen-Chao Wang, Fu-Cheng Chu
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引用次数: 1

摘要

本文采用fcCSP结构,在有机衬底上设计了2 × 2毫米波AiP阵列。在有机基板的底部放置射频芯片,在有机基板的正面设计AiP阵列。此外,从芯片到天线的转换损耗与封装天线(Antenna-in-Package)技术中的再分布层(RDL)厚度、钝化厚度和钝化材料特性有关。然而,尚不清楚参数以何种方式真正影响转换损失。本研究旨在为AiP技术提供从芯片到天线转换的最低损耗。这项工作还表明,在28 GHz和77 GHz下,从芯片到AiP的转换损失分别减少了35%和44%。设计的AiP在26.4 ~ 29.7 GHz范围内回波损耗小于10 dB,带宽为~3.4 GHz,可为5G毫米波应用提供高增益(大于~5 dBi)的辐射方向图。此外,许多研究人员发表了大量有关毫米波AiP设计的相关论文,但目前还没有明确的毫米波AiP量产的测量解决方案或流程。在设计阶段,利用球形室对单天线性能进行验证。它可以通过射频探头在C4凹凸垫或微凹凸垫上直接测量,得到单天线的二维或三维辐射方向图。从仿真和实测结果来看,两者具有良好的相关性。在工程阶段,射频芯片安装在有机基板的底部。AiP装置可以利用紧凑型天线测试范围(CATR)室获得所有相关辐射方向图,如2D/3D方向图和EIRP。当然,CART是波束形成测量的一个很好的验证方案。最后,对于大规模生产,宣布了一套用于毫米波AiP或SiP生产测试的测试集。通过三种不同的测量解决方案和毫米波测量流程,提供了从设计到验证的完整毫米波AiP和SiP流程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance Analysis and Test Solution with Integrated Antenna-in-Package for Millimeter-Wave System
In this paper, the 2 by 2 mmWave AiP array is design in organic substrate using fcCSP structure. The RF die is placed on bottom side of organic substrate and the AiP array is designed in the front side of organic substrate. Furthermore, the losses of transition from chip to antennas are related to thickness of redistribution layer (RDL), passivation thickness, and passivation material characteristic in AiP(Antenna-in-Package) technology. However, it is not clear in which manner a parameter really affects the losses of transition. This study tends to offer the lowest losses of transition from chip to antenna for AiP technology. This work also demonstrates the reduction of losses of transition from chip to AiP approximated 35% and 44% at 28 and 77 GHz. The designed AiP has better than 10 dB return loss in 26.4-29.7 GHz range, with ~3.4 GHz bandwidth and provides a high-gain (above ~5 dBi) radiation pattern for 5G mmWave application. In addition, many researchers have published lots of related papers about mmWave AiP design, but it is not clear a measurement solution or flow in mass production for mmWave AiP. In design stage, the spherical chamber is utilized to validate single antenna performance. It can direct measurement by RF prober on C4 bump pad or micro bump pad to get 2D or 3D radiation pattern of single antenna. From the simulation and measurement results, there is a good correlation. In engineering stage, the RF die is mounted on the bottom of organic substrate. The AiP device can utilize the compact antenna test range (CATR) chamber to get all relative radiation patterns, such as 2D/3D pattern and EIRP. Of course, the CART is a good validation solution for beamforming measurement. Finally, for mass production, a testing set is announced for mmWave AiP or SiP production test. Through the three different measurement solutions and mmWave measurement flow, a completed mmWave AiP and SiP flow from design to validation is delivered.
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