{"title":"毫米波系统集成封装天线性能分析与测试解决方案","authors":"Sheng-Chi Hsieh, Cheng-Yu Ho, Chen-Chao Wang, Fu-Cheng Chu","doi":"10.1109/ESTC48849.2020.9229721","DOIUrl":null,"url":null,"abstract":"In this paper, the 2 by 2 mmWave AiP array is design in organic substrate using fcCSP structure. The RF die is placed on bottom side of organic substrate and the AiP array is designed in the front side of organic substrate. Furthermore, the losses of transition from chip to antennas are related to thickness of redistribution layer (RDL), passivation thickness, and passivation material characteristic in AiP(Antenna-in-Package) technology. However, it is not clear in which manner a parameter really affects the losses of transition. This study tends to offer the lowest losses of transition from chip to antenna for AiP technology. This work also demonstrates the reduction of losses of transition from chip to AiP approximated 35% and 44% at 28 and 77 GHz. The designed AiP has better than 10 dB return loss in 26.4-29.7 GHz range, with ~3.4 GHz bandwidth and provides a high-gain (above ~5 dBi) radiation pattern for 5G mmWave application. In addition, many researchers have published lots of related papers about mmWave AiP design, but it is not clear a measurement solution or flow in mass production for mmWave AiP. In design stage, the spherical chamber is utilized to validate single antenna performance. It can direct measurement by RF prober on C4 bump pad or micro bump pad to get 2D or 3D radiation pattern of single antenna. From the simulation and measurement results, there is a good correlation. In engineering stage, the RF die is mounted on the bottom of organic substrate. The AiP device can utilize the compact antenna test range (CATR) chamber to get all relative radiation patterns, such as 2D/3D pattern and EIRP. Of course, the CART is a good validation solution for beamforming measurement. Finally, for mass production, a testing set is announced for mmWave AiP or SiP production test. Through the three different measurement solutions and mmWave measurement flow, a completed mmWave AiP and SiP flow from design to validation is delivered.","PeriodicalId":6785,"journal":{"name":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","volume":"74 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Performance Analysis and Test Solution with Integrated Antenna-in-Package for Millimeter-Wave System\",\"authors\":\"Sheng-Chi Hsieh, Cheng-Yu Ho, Chen-Chao Wang, Fu-Cheng Chu\",\"doi\":\"10.1109/ESTC48849.2020.9229721\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the 2 by 2 mmWave AiP array is design in organic substrate using fcCSP structure. The RF die is placed on bottom side of organic substrate and the AiP array is designed in the front side of organic substrate. Furthermore, the losses of transition from chip to antennas are related to thickness of redistribution layer (RDL), passivation thickness, and passivation material characteristic in AiP(Antenna-in-Package) technology. However, it is not clear in which manner a parameter really affects the losses of transition. This study tends to offer the lowest losses of transition from chip to antenna for AiP technology. This work also demonstrates the reduction of losses of transition from chip to AiP approximated 35% and 44% at 28 and 77 GHz. The designed AiP has better than 10 dB return loss in 26.4-29.7 GHz range, with ~3.4 GHz bandwidth and provides a high-gain (above ~5 dBi) radiation pattern for 5G mmWave application. In addition, many researchers have published lots of related papers about mmWave AiP design, but it is not clear a measurement solution or flow in mass production for mmWave AiP. In design stage, the spherical chamber is utilized to validate single antenna performance. It can direct measurement by RF prober on C4 bump pad or micro bump pad to get 2D or 3D radiation pattern of single antenna. From the simulation and measurement results, there is a good correlation. In engineering stage, the RF die is mounted on the bottom of organic substrate. The AiP device can utilize the compact antenna test range (CATR) chamber to get all relative radiation patterns, such as 2D/3D pattern and EIRP. Of course, the CART is a good validation solution for beamforming measurement. Finally, for mass production, a testing set is announced for mmWave AiP or SiP production test. Through the three different measurement solutions and mmWave measurement flow, a completed mmWave AiP and SiP flow from design to validation is delivered.\",\"PeriodicalId\":6785,\"journal\":{\"name\":\"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)\",\"volume\":\"74 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-09-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC48849.2020.9229721\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC48849.2020.9229721","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance Analysis and Test Solution with Integrated Antenna-in-Package for Millimeter-Wave System
In this paper, the 2 by 2 mmWave AiP array is design in organic substrate using fcCSP structure. The RF die is placed on bottom side of organic substrate and the AiP array is designed in the front side of organic substrate. Furthermore, the losses of transition from chip to antennas are related to thickness of redistribution layer (RDL), passivation thickness, and passivation material characteristic in AiP(Antenna-in-Package) technology. However, it is not clear in which manner a parameter really affects the losses of transition. This study tends to offer the lowest losses of transition from chip to antenna for AiP technology. This work also demonstrates the reduction of losses of transition from chip to AiP approximated 35% and 44% at 28 and 77 GHz. The designed AiP has better than 10 dB return loss in 26.4-29.7 GHz range, with ~3.4 GHz bandwidth and provides a high-gain (above ~5 dBi) radiation pattern for 5G mmWave application. In addition, many researchers have published lots of related papers about mmWave AiP design, but it is not clear a measurement solution or flow in mass production for mmWave AiP. In design stage, the spherical chamber is utilized to validate single antenna performance. It can direct measurement by RF prober on C4 bump pad or micro bump pad to get 2D or 3D radiation pattern of single antenna. From the simulation and measurement results, there is a good correlation. In engineering stage, the RF die is mounted on the bottom of organic substrate. The AiP device can utilize the compact antenna test range (CATR) chamber to get all relative radiation patterns, such as 2D/3D pattern and EIRP. Of course, the CART is a good validation solution for beamforming measurement. Finally, for mass production, a testing set is announced for mmWave AiP or SiP production test. Through the three different measurement solutions and mmWave measurement flow, a completed mmWave AiP and SiP flow from design to validation is delivered.