{"title":"英特尔®至强®处理器D:第一款针对密集解决方案优化的至强处理器","authors":"D. Nagaraj, C. Gianos","doi":"10.1109/HOTCHIPS.2015.7477468","DOIUrl":null,"url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. Conclusions: Broadwell-DE brings Xeon class performance and capabilities to dense solutions with higher power efficiency; Focused engineering to co-optimize the platform and SoC to achieve density and power targets; Rich feature set across Virtualization, Security RAS and Power Management; New optimization choices for Hyperscale cloud environments, Networking and for dense, low power storage solutions; Delivers up to 3.4X the performance and up to 1.7X perf/watt over the 22nm Atom C2000 SoC family.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"54 1","pages":"1-22"},"PeriodicalIF":0.0000,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Intel® Xeon® Processor D: The First Xeon processor optimized for dense solutions\",\"authors\":\"D. Nagaraj, C. Gianos\",\"doi\":\"10.1109/HOTCHIPS.2015.7477468\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article consists of a collection of slides from the authors' conference presentation. Conclusions: Broadwell-DE brings Xeon class performance and capabilities to dense solutions with higher power efficiency; Focused engineering to co-optimize the platform and SoC to achieve density and power targets; Rich feature set across Virtualization, Security RAS and Power Management; New optimization choices for Hyperscale cloud environments, Networking and for dense, low power storage solutions; Delivers up to 3.4X the performance and up to 1.7X perf/watt over the 22nm Atom C2000 SoC family.\",\"PeriodicalId\":6666,\"journal\":{\"name\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"volume\":\"54 1\",\"pages\":\"1-22\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE Hot Chips 27 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2015.7477468\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Hot Chips 27 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2015.7477468","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
摘要
本文由作者在会议上演讲的幻灯片集合组成。结论:Broadwell-DE为高密度解决方案带来了至强级的性能和能力,并具有更高的功率效率;聚焦工程,共同优化平台和SoC,以实现密度和功耗目标;丰富的功能集跨越虚拟化,安全RAS和电源管理;针对超大规模云环境、网络和密集、低功耗存储解决方案的新优化选择;与22nm Atom C2000 SoC系列相比,可提供高达3.4倍的性能和高达1.7倍的perf/watt。
Intel® Xeon® Processor D: The First Xeon processor optimized for dense solutions
This article consists of a collection of slides from the authors' conference presentation. Conclusions: Broadwell-DE brings Xeon class performance and capabilities to dense solutions with higher power efficiency; Focused engineering to co-optimize the platform and SoC to achieve density and power targets; Rich feature set across Virtualization, Security RAS and Power Management; New optimization choices for Hyperscale cloud environments, Networking and for dense, low power storage solutions; Delivers up to 3.4X the performance and up to 1.7X perf/watt over the 22nm Atom C2000 SoC family.