氧等离子体制备清洁MgO表面:与标准衬底清洗程序的比较

J. Geler-Kremer, A. Posadas, A. Demkov
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引用次数: 5

摘要

对氧化外延中广泛使用的衬底MgO的不同表面制备方法进行了综述和比较。我们发现原位表面制备方法优于非原位制备方法。我们发现,在200°C的氧等离子体暴露下,不需要高温退火,就可以完全去除MgO表面的氢氧化物、碳酸盐和非定形碳。使用该工艺,证明了均方根粗糙度值为~ 0.1 nm的原子平面。这样处理的表面也显示出尖锐的RHEED条纹,表明表面的结晶秩序良好。我们还表明,MgO的高温退火,无论是本身还是遵循其他非原位清洗方法,如溶剂清洗,都是去除表面污染物的一种相当有效的方法,使其表面粗糙度达到~ 0.2 nm。我们发现,湿蚀刻或其他非原位清洗方法单独不退火不能消除所有表面污染物,甚至可能显著恶化表面粗糙度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation of clean MgO surface by oxygen plasma: Comparison with standard substrate cleaning procedures
Different surface preparation methods for cleaning MgO, a widely used substrate in oxide epitaxy, are summarized and compared. We find that in situ surface preparation methods are preferable to ex situ preparation methods. We show that the complete removal of hydroxide, carbonate, and adventitious carbon from the MgO surface can be achieved via oxygen plasma exposure at 200 °C without high temperature annealing. Using this process, an atomically flat surface with root mean square roughness values of ∼0.1 nm is demonstrated. Surfaces treated thus also exhibit sharp RHEED streaks indicating good crystalline order of the surface. We also show that high temperature annealing of MgO, either by itself or following other ex situ cleaning methods, such as solvent cleaning, is a reasonably effective method for the removal of surface contaminants, enabling one to achieve a surface roughness of ∼0.2 nm. We show that wet etching or other ex situ cleaning methods alone without annealing cannot eliminate all surface contaminants and may even worsen the surface roughness significantly.
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