通过优化亚10nm节点CMOS栅极-金属节的齿轮传动比来提高性能、功率和面积

Y. Ban, Xuelian Zhu, J. Petykiewicz, J. Zeng
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引用次数: 3

摘要

本文介绍了在亚10nm节点CMOS SoC设计中,通过优化栅极和垂直金属层间距之间的传动比(GR),获得的性能,功率和面积(PPA)的改进。将GR从1:1更改为3:2可以获得更好的引脚可访问性、可路由性和更高的单元密度。这反过来使门螺距松弛和相关的细胞延迟改善成为可能。在典型的PVT条件下,在SoC CPU块中实现3:2 GR超密集单元可使性能提高17%,逻辑尺寸减小4%,动态功率降低8%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improving Performance, Power, and Area by Optimizing Gear Ratio of Gate-Metal Pitches in Sub-10nm Node CMOS Designs
This paper presents improvements in performance, power, and area (PPA) obtained by optimizing the gear ratio (GR) between the Gate and vertical metal layer pitches in standard cells in sub-10nm node CMOS SoC designs. Changing the GR from 1:1 to 3:2 leads to better pin accessibility, routability, and higher cell density. This in turn enables a gate pitch relaxation and associated improvements in cell delay. Implementation of 3:2 GR ultra-dense cells in an SoC CPU block results in up to 17% higher performance, 4% smaller logic size, and 8% lower dynamic power at typical PVT conditions.
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