α-氧化铝外延硅薄膜的电学性能

P. B. Hart, P. Etter, B. Jervis, J. Flanders
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引用次数: 21

摘要

通过硅烷热解,在α-氧化铝(1102)平面上沉积了硅单晶薄膜。研究了薄膜中载流子浓度和迁移率随生长温度和衬底制备的变化规律。还研究了初始增长率和总增长率的影响。未掺杂层为p型,载流子浓度随生长温度变化在1015 ~ 1017孔/cm3之间。已经获得了高达174 cm2 v-1秒-1的空穴迁移率。在该材料中形成了二极管、MOST和低增益双极晶体管,并从器件特性估计了纳秒范围内的少数载流子寿命。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical properties of epitaxial silicon films on α-alumina
Single-crystal films of silicon have been deposited on the (1l02) plane of α-alumina by the pyrolysis of silane. Carrier concentration and mobility have been studied in the films as functions of growth temperature and substrate preparation. The effects of initial and overall growth rate have also been examined. Undoped layers are p-type with carrier concentrations from 1015 to 1017 holes/cm3 depending on growth temperature. Hole mobilities up to 174 cm2 v-1 sec-1 have been obtained. Diodes, MOST's and low-gain bipolar transistors have been formed in the material and minority carrier lifetime in the nanosecond range has been estimated from device characteristics.
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