研究三维硅通孔中势垒完整性的电表征方法

Y. Li, D. Velenis, T. Kauerauf, M. Stucchi, Y. Civale, A. Redolfi, K. Croes
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引用次数: 23

摘要

本文采用可控I-V (IVctrl)方法在晶圆级对tsv的势垒完整性进行表征。平面电容结构用于IVctrl方法相对于传统的时间相关介质击穿(TDDB)方法的初始验证。利用IVctrl在合理的时间内提取了TSV衬管的TDDB场加速度因子,结果表明,缺陷屏障会降低TDDB场加速度因子,从而降低TSV衬管的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical characterization method to study barrier integrity in 3D through-silicon vias
In this paper, the controlled I-V (IVctrl) method is adopted for the barrier integrity characterization of TSVs at wafer level. Planar capacitor structures are used for the initial validation of the IVctrl method with respect to the traditional time dependent dielectric breakdown (TDDB) methodology. The TDDB field acceleration factor of the TSV liner is extracted by IVctrl in a reasonable time, and the results demonstrate that defective barriers can degrade TDDB field acceleration factor and thus TSV liner reliability.
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