Y. Li, D. Velenis, T. Kauerauf, M. Stucchi, Y. Civale, A. Redolfi, K. Croes
{"title":"研究三维硅通孔中势垒完整性的电表征方法","authors":"Y. Li, D. Velenis, T. Kauerauf, M. Stucchi, Y. Civale, A. Redolfi, K. Croes","doi":"10.1109/ECTC.2012.6248846","DOIUrl":null,"url":null,"abstract":"In this paper, the controlled I-V (IVctrl) method is adopted for the barrier integrity characterization of TSVs at wafer level. Planar capacitor structures are used for the initial validation of the IVctrl method with respect to the traditional time dependent dielectric breakdown (TDDB) methodology. The TDDB field acceleration factor of the TSV liner is extracted by IVctrl in a reasonable time, and the results demonstrate that defective barriers can degrade TDDB field acceleration factor and thus TSV liner reliability.","PeriodicalId":6384,"journal":{"name":"2012 IEEE 62nd Electronic Components and Technology Conference","volume":"9 1","pages":"304-308"},"PeriodicalIF":0.0000,"publicationDate":"2012-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":"{\"title\":\"Electrical characterization method to study barrier integrity in 3D through-silicon vias\",\"authors\":\"Y. Li, D. Velenis, T. Kauerauf, M. Stucchi, Y. Civale, A. Redolfi, K. Croes\",\"doi\":\"10.1109/ECTC.2012.6248846\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the controlled I-V (IVctrl) method is adopted for the barrier integrity characterization of TSVs at wafer level. Planar capacitor structures are used for the initial validation of the IVctrl method with respect to the traditional time dependent dielectric breakdown (TDDB) methodology. The TDDB field acceleration factor of the TSV liner is extracted by IVctrl in a reasonable time, and the results demonstrate that defective barriers can degrade TDDB field acceleration factor and thus TSV liner reliability.\",\"PeriodicalId\":6384,\"journal\":{\"name\":\"2012 IEEE 62nd Electronic Components and Technology Conference\",\"volume\":\"9 1\",\"pages\":\"304-308\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-07-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"23\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 62nd Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2012.6248846\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 62nd Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2012.6248846","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical characterization method to study barrier integrity in 3D through-silicon vias
In this paper, the controlled I-V (IVctrl) method is adopted for the barrier integrity characterization of TSVs at wafer level. Planar capacitor structures are used for the initial validation of the IVctrl method with respect to the traditional time dependent dielectric breakdown (TDDB) methodology. The TDDB field acceleration factor of the TSV liner is extracted by IVctrl in a reasonable time, and the results demonstrate that defective barriers can degrade TDDB field acceleration factor and thus TSV liner reliability.
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