负电容,n沟道,Si finfet:双向低于60 mV/dec,负DIBL,负差分电阻和改进的短沟道效应

Hong Zhou, D. Kwon, A. Sachid, Y. Liao, K. Chatterjee, A. Tan, A. Yadav, C. Hu, S. Salahuddin
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引用次数: 34

摘要

我们报道了以铁电f0.5 zr0.5 o2 (HZO)作为栅极介质的负电容(NC) finfet,其沟道长度(LCH)为450 nm至30 nm,多翅片宽度(WFIN)为200 nm至30 nm。我们展示了NCFET所期望的所有特征:几乎无迟滞工作(~3 mV), <60 mV/十进亚阈值摆幅(SS),平均SS为54.5 mV/dec,为~2阶ID,据我们所知,这是第一次在Si mosfet中,负漏极诱导势垒降低(DIBL)和负差分电阻(NDR)。值得注意的是,与控制finfet相比,我们观察到短通道效应的显著改善:对于相同的Lch/WFin比,nfet的SS和DIBL都大大降低。重要的是,对于较短的通道长度,这些好处变得越来越大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Negative Capacitance, n-Channel, Si FinFETs: Bi-directional Sub-60 mV/dec, Negative DIBL, Negative Differential Resistance and Improved Short Channel Effect
We report on negative capacitance (NC) FinFETs with ferroelectric Hf0.5Zr0.5O2 (HZO) as gate dielectric on fully depleted silicon on insulator (FDSOI) substrate with various channel length (LCH) of 450 nm to 30 nm and multiple fin widths (WFIN) of 200 nm to 30 nm. We demonstrate all signature characteristics expected from NCFET: nearly hysteresis free operation (~3 mV), <60 mV/decade subthreshold swing (SS) with an average SS of 54.5 mV/dec for ~2 orders of ID and to the best of our knowledge, for the first time in Si MOSFETs, negative Drain Induced Barrier Lowering (DIBL) and Negative Differential Resistance (NDR). Remarkably, we observe significant improvement in the short channel effect compared to control FinFETs: both SS and DIBL are substantially lower for the NCFET for the same Lch/WFin ratio. Importantly, these benefits become increasingly larger for shorter channel lengths.
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