用于量子信息处理的超导光子-声子混合芯片

Chip Pub Date : 2022-09-01 DOI:10.1016/j.chip.2022.100016
Xin-Biao Xu , Wei-Ting Wang , Lu-Yan Sun , Chang-Ling Zou
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引用次数: 5

摘要

将具有长相干时间的量子比特与功能量子器件集成在单个芯片上,从而实现全固态量子计算芯片,是当前量子信息处理实验研究的重要目标。在各种量子平台中,光子量子芯片和超导量子芯片取得了一系列重大进展,量子比特的数量和量子电路的复杂性都在不断增加。虽然这两种芯片平台各自具有独特的优势和潜力,但它们的不足也逐渐显露出来,需要加以解决。通过引入声子集成器件,可以将所有非悬浮的声子、光子和超导量子器件有机地组合在同一芯片上,实现它们之间的相干耦合。本文对用于量子信息处理的集成光子、超导和混合量子芯片进行了展望和简要综述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hybrid superconducting photonic-phononic chip for quantum information processing

The integration of qubits with long coherence times and functional quantum devices on a single chip, and thus the realization of an all-solid-state quantum computing chip, is an important goal in current experimental research on quantum information processing. Among various quantum platforms, a series of significant progresses have been made in photonic quantum chips and superconducting quantum chips, while both the number of qubits and the complexity of quantum circuits have been increasing. Although these two chip platforms have respective unique advantages and potentials, their shortcomings have been gradually revealed and need to be solved. By introducing phonon-integrated devices, it is possible to combine all unsuspended phononic, photonic, and superconducting quantum devices organically on the same chip to achieve coherent coupling among them. Here, we provide a prospect and a short review on the integrated photonic, superconducting, and hybrid quantum chips for quantum information processing.

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