BAW谐振器外源老化的分析模型

J. Segovia-Fernandez, Ernest Ting-Ta Yen, Javier Rojas, T. Tran, M. Chowdhury, P. Smeys
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引用次数: 0

摘要

本文介绍了一种一维分析模型,用于预测由于封装应力松弛引起的体声波(BAW)谐振器老化。经典的微声谐振器老化模型依赖于一个对数函数来估计10年的不稳定性。然而,该函数是通过实验拟合的,没有考虑物理应力现象。相反,我们提出的分析模型通过将BAW中的热诱导应力与附着环氧树脂的蠕变响应联系起来来计算频率漂移。为了验证该模型,我们设计了一个实验,将一种称为DBAR的BAW谐振器附着在单个环氧树脂层上,并经受不同的烘烤条件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Analytical Model to Predict Extrinsic Aging in BAW Resonators
This manuscript introduces a 1D analytical model to predict the Bulk Acoustic Wave (BAW) resonator aging when it is due to package stress relaxation. Classical micro-acoustic resonator aging models rely on a logarithmic function to estimate the 10-year instability. However, this function is fitted through experiments and does not take into account the physical stress phenomenon. Instead, our proposed analytical model computes the frequency drift by relating the thermally-induced stress in BAW to the creep response of attached epoxy. To validate the model, we design an experiment in which a type of BAW resonator known as DBAR is attached to a single epoxy layer and subjected to different baking conditions.
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