芯片级硅光子收发器的高温工作

D. Okamoto, Y. Suzuki, J. Fujikata, M. Tokushima, J. Ushida, T. Horikawa, K. Takemura, T. Nakamura, Y. Hagihara, K. Yashiki, M. Kurihara, K. Kinoshita, K. Kurata
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引用次数: 0

摘要

基于硅光子学技术和光电组件技术,开发了一种芯片级光收发器,适用于25gbsx四通道应用。通过量子点激光二极管、光学引脚和基于28纳米CMOS的电子集成电路的混合集成,将光发射器和接收器集成在单个硅平台上。温度补偿功能在调制器驱动器和透阻放大器中实现,用于高温操作。这些函数使我们能够成功地演示在85°C下无错误的25 Gb $/\ mathm {s}\次\ mathm{4}$通道数据传输。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-Temperature Operation of Chip-Scale Silicon-Photonic Transceiver
A chip-scale optical transceiver was developed based on silicon photonics technology and optical/electrical assembly for 25-Gbs× four -channel applications. Optical transmitters and receivers were integrated on a single silicon platform enabled by the hybrid integration of a quantum-dot laser diode, optical pins, and a 28-nm CMOS based electrical IC. Temperature compensation functions were implemented in a modulator driver and a transimpedance amplifier for high-temperature operations. The functions allowed us to successfully demonstrate error-free 25 Gb $/\mathrm{s}\times \mathrm{four}$ -channel data transmission at 85°C.
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