热管理研究-从电力电子到便携设备

K. Jung, Chi Zhang, Tanya Liu, M. Asheghi, K. Goodson
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引用次数: 2

摘要

从服务器和智能手机到雷达hemt和混合动力汽车转换器,热管理对电子系统至关重要。通过新材料和微流体技术,芯片和封装领域的研究取得了快速进展。一个非常有前途的领域是热超材料,它通过微或纳米尺度的非均质性、孔隙度和/或分层,提供了热、机械、流体和其他特性的不同寻常的组合。另一个领域是流体系统的性能和效率的提升——包括基于毛细管的和泵送的,它们将热量转移到外部热分离器。这次演讲总结了进展,并强调了与半导体工业,美国国防公司和国家科学基金会电力电子中心(诗人)的合作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal Management Research – from Power Electronics to Portables
Thermal management is critical for electronic systems ranging from servers and smartphones to radar HEMTs and hybrid vehicle converters. Rapid research progress is being achieved both on-chip and in packaging through new materials and microfluidics. One very promising area is thermal metamaterials, which offer unusual combinations of thermal, mechanical, fluidic, and other properties by means of micro- or nanoscale heterogeneity, porosity, and/or layering. Another area is the upscaling of the performance and efficiency of fluidic systems – both capillary-based and pumped, which remove heat to an external heat rejector. This talk summarizes progress and highlights collaborations with the semiconductor industry, US defense companies and the NSF center on power electronics (POETS).
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