原位原子氢清洁中掺杂n-Ge的“冷”低接触电阻率欧姆接触实验证明

A. Agrawal, Jeongwon Park, D. Mohata, K. Ahmed, S. Datta
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引用次数: 0

摘要

在1×1019 cm-3掺杂ND下,n-Ge表面出现了低接触电阻率欧姆接触。原子氢(H*)清洁后的样品比接触电阻率(ρC)第一次降低了7%,这是由于与不清洁样品相比,阻挡高度降低了70meV。改进的主要原因是氧化锗、GeOx的减少,以及能量色散x射线光谱(EDS)证实的界面上H原子的表面钝化。当掺杂密度为1×1019 cm-3时,2.7×10-5 Ω-cm2的ρC最小,热收支最小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental demonstration of “Cold” low contact resistivity ohmic contacts on moderately doped n-Ge with in-situ atomic hydrogen clean
Low contact resistivity ohmic contacts are demonstrated on n-Ge at doping level ND of 1×1019 cm-3. Atomic Hydrogen (H*) clean was shown to reduce the specific contact resistivity (ρC) by 7% for the first time, due to reduction of barrier height of 70meV compared to the unclean sample. Improvement was primarily due to the reduction of the germanim oxide, GeOx, and surface passivation at the interface by H atoms as confirmed by energy-dispersive X-ray spectroscopy (EDS). The ρC of 2.7×10-5 Ω-cm2, at a moderate doping density of 1×1019 cm-3, is the lowest with the minimum possible thermal budget.
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