{"title":"多层磁芯上的高性能3d微变压器","authors":"A. Moazenzadeh, N. Spengler, U. Wallrabe","doi":"10.1109/MEMSYS.2013.6474234","DOIUrl":null,"url":null,"abstract":"We present the fabrication of 3D-microtransformers combining a new type of multilayered magnetic core and coil winding with an automatic wirebonder. For the magnetic cores we stapled up to 30 layers of 20 μm thick amorphous metal layers with an industrial laminator. Intermediate layers of 10 μm thick double-sided sticky tape provided adhesion and electrical insulation. Electrical discharge machining was used to precisely cut these magnetic stacks to sub-millimeter cubes. To flip the cubes by 90° and assemble them onto a wafer for coil winding, we produced a receptor wafer providing magnetic landing sites. Subsequently, to wind a primary and secondary coil, one on top of the other, an automatic wirebonder was employed with 25 μm thick insulated Gold wire. A fabricated transformer with a core size of 0.9*0.8*1 mm3 yielded an inductance of 1412 nH and a coupling factor of 97%. The maximum transformer efficiency of 73% was measured at a load of 50 Ω.","PeriodicalId":92162,"journal":{"name":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","volume":"5 1","pages":"287-290"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"High-performance, 3D-microtransformers on multilayered magnetic cores\",\"authors\":\"A. Moazenzadeh, N. Spengler, U. Wallrabe\",\"doi\":\"10.1109/MEMSYS.2013.6474234\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present the fabrication of 3D-microtransformers combining a new type of multilayered magnetic core and coil winding with an automatic wirebonder. For the magnetic cores we stapled up to 30 layers of 20 μm thick amorphous metal layers with an industrial laminator. Intermediate layers of 10 μm thick double-sided sticky tape provided adhesion and electrical insulation. Electrical discharge machining was used to precisely cut these magnetic stacks to sub-millimeter cubes. To flip the cubes by 90° and assemble them onto a wafer for coil winding, we produced a receptor wafer providing magnetic landing sites. Subsequently, to wind a primary and secondary coil, one on top of the other, an automatic wirebonder was employed with 25 μm thick insulated Gold wire. A fabricated transformer with a core size of 0.9*0.8*1 mm3 yielded an inductance of 1412 nH and a coupling factor of 97%. The maximum transformer efficiency of 73% was measured at a load of 50 Ω.\",\"PeriodicalId\":92162,\"journal\":{\"name\":\"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)\",\"volume\":\"5 1\",\"pages\":\"287-290\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2013.6474234\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2013.6474234","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High-performance, 3D-microtransformers on multilayered magnetic cores
We present the fabrication of 3D-microtransformers combining a new type of multilayered magnetic core and coil winding with an automatic wirebonder. For the magnetic cores we stapled up to 30 layers of 20 μm thick amorphous metal layers with an industrial laminator. Intermediate layers of 10 μm thick double-sided sticky tape provided adhesion and electrical insulation. Electrical discharge machining was used to precisely cut these magnetic stacks to sub-millimeter cubes. To flip the cubes by 90° and assemble them onto a wafer for coil winding, we produced a receptor wafer providing magnetic landing sites. Subsequently, to wind a primary and secondary coil, one on top of the other, an automatic wirebonder was employed with 25 μm thick insulated Gold wire. A fabricated transformer with a core size of 0.9*0.8*1 mm3 yielded an inductance of 1412 nH and a coupling factor of 97%. The maximum transformer efficiency of 73% was measured at a load of 50 Ω.