紫外光纳秒脉冲激光退火制备铜晶粒

T. Tabata, P. Raynal, F. Rozé, Sebastien Halty, Louis Thuries, F. Cristiano, E. Scheid, F. Mazzamuto
{"title":"紫外光纳秒脉冲激光退火制备铜晶粒","authors":"T. Tabata, P. Raynal, F. Rozé, Sebastien Halty, Louis Thuries, F. Cristiano, E. Scheid, F. Mazzamuto","doi":"10.1109/IITC51362.2021.9537312","DOIUrl":null,"url":null,"abstract":"UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surrounding structures. In this work UV NLA is applied on a typical Cu thin film, demonstrating a mean grain size of over 1 μm and 400 nm in a melt and sub-melt regime, respectively. Along with such grain enlargement, film resistivity is also reduced.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Copper Large-Scale Grain Growth by UV Nanosecond Pulsed Laser Annealing\",\"authors\":\"T. Tabata, P. Raynal, F. Rozé, Sebastien Halty, Louis Thuries, F. Cristiano, E. Scheid, F. Mazzamuto\",\"doi\":\"10.1109/IITC51362.2021.9537312\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surrounding structures. In this work UV NLA is applied on a typical Cu thin film, demonstrating a mean grain size of over 1 μm and 400 nm in a melt and sub-melt regime, respectively. Along with such grain enlargement, film resistivity is also reduced.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC51362.2021.9537312\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537312","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

紫外纳秒脉冲激光退火(UV NLA)既可以实现表面局部加热,也可以实现短时间尺度的高温处理,这有利于通过扩大线或薄膜中的金属晶粒来降低金属线电阻,同时保持周围结构的完整性和性能。在这项工作中,紫外NLA应用于典型的Cu薄膜,在熔融和亚熔融状态下分别显示了超过1 μm和400 nm的平均晶粒尺寸。随着晶粒增大,薄膜电阻率也随之降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Copper Large-Scale Grain Growth by UV Nanosecond Pulsed Laser Annealing
UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surrounding structures. In this work UV NLA is applied on a typical Cu thin film, demonstrating a mean grain size of over 1 μm and 400 nm in a melt and sub-melt regime, respectively. Along with such grain enlargement, film resistivity is also reduced.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信