高性能DRAM外围晶体管中锑注入形成源极/漏极扩展

J. Cha, S. Jin, Anbae Lee, Hun-Sung Lee, Dongseok Kim, Jihwan Park, Ilsik Jang, Ahyoung Oh, S. Jang, S. Yeom, Sung-ki Park, Cjay Cho, S. Hwang, Jongwon Park, Sungho Jo
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引用次数: 0

摘要

我们利用TEM, SIMS和4点探针研究了锑注入Si在退火前后的晶体缺陷,掺杂分布和片电阻等特性。Sb注入Si的片电阻比砷低35%,尽管结深浅25%。与As相比,注入Sb的源极/漏极扩展电极的离子/ off特性提高了10%,而漏极诱导的势垒降低没有退化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Formation of Source/Drain extension by Antimony implantation for high performance DRAM peripheral transistors
We have investigated properties of Antimony implanted Si such as crystalline defect, dopant distribution, and sheet resistance before and after annealing using TEM, SIMS, and 4-point probe. The sheet resistance of Sb implanted Si shows 35% lower than Arsenic, even though junction depth is 25% shallower. Electrical behaviors of Sorce/Drain extension implanted with Sb show 10% improvement of Ion/Ioff characteristics without degradation of drain-induced barrier lowering compared to the As.
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