OUM -用于独立和嵌入式应用的180nm非易失性存储单元元件技术

S. Lai, T. Lowrey
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引用次数: 309

摘要

本文讨论了180nm技术节点上基于硫族化合物的相变非易失性半导体存储技术OUM (Ovonic Unified memory)的存储单元元件的发展现状。我们将回顾存储器元件的器件结构和特性。该技术的主要特点是超高密度、低电压、高速编程、高周期计数、高读取速度和具有竞争力的成本结构,适用于独立和嵌入式应用的非易失性存储器。这项技术本身具有抗辐射能力,并且是位字节或字可编程的,不需要像flash一样的块擦除。低电压和低能量操作使OUM成为移动应用程序的一个有吸引力的候选者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
OUM - A 180 nm nonvolatile memory cell element technology for stand alone and embedded applications
This paper discusses the development status of the memory cell element of OUM (Ovonic Unified Memory) - a chalcogenide-based, phase-change nonvolatile semiconductor memory technology at the 180 nm technology node. The device structure and characterization of the memory element will be reviewed. The key characteristics of the technology will be discussed for ultra-high density, low voltage, high-speed programming, high cycle count, high read speed, and competitive cost structure nonvolatile memory for stand alone and embedded applications. This technology is inherently radiation resistant and is bit byte or word programmable without the requirement of Flash-like block erase. Low voltage and energy operation make OUM an attractive candidate for mobile applications.
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