半导体晶圆制造中分层生产计划的迭代方法

Rajarshi Bardhan, Chi Xu, Zhiguang Cao, Puay Siew Tan
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引用次数: 1

摘要

本文研究了多产品半导体晶圆制造工厂的生产计划和调度问题,该问题处理了多个可重入回路和不同设备特性等挑战性因素。本文提出了一种分层生产计划和调度方法,该方法使用迭代方法来改进生产计划以解决这一问题。通过求解一个线性规划问题,得到一个服务于多个目标的生产计划,然后在给定调度规则下进行模拟运行,以评估性能差距。计划和模拟阶段以迭代的方式执行,以减少计划生产水平与模拟结果之间的性能差距。提出了一种调度规则,其中晶圆片的优先级由在制品(WIP)或生产状态派生。基于Intel微型晶圆厂的数值模拟,考虑了多产品的到期日期需求,对所提方法的性能进行了评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Iterative Scheme for Hierarchical Production Planning in Semiconductor Wafer Fabrication
This paper considers a production planning and scheduling problem in a multi-product semiconductor wafer fabrication facility, which copes with the challenging factors including multiple re-entrant loops and diverse equipment characteristics. This work proposes a hierarchical production planning and scheduling approach that uses an iterative method for refining production plans to solve this problem. A production plan serving multiple objectives is derived by solving a linear programming problem, which is followed by a simulation run with a given scheduling rule to evaluate the performance gap. The planning and the simulation phases are executed in an iterative manner to reduce the performance gap between the planned production level and that from simulation outcome. A scheduling rule is proposed whereby the priority of a wafer is derived from the state of work-in-process (WIP) or production at that instant. The performance of the proposed method is assessed based on numerical simulations carried on Intel mini fab taking due date based demands for multiple products into consideration.
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