P. Bafna, P. Karkare, S. Srinivasan, S. Chopra, S. Lashkare, Y. Kim, S. Srinivasan, S. Kuppurao, S. Lodha, U. Ganguly
{"title":"基于外延Si穿孔的双极RRAM选择器","authors":"P. Bafna, P. Karkare, S. Srinivasan, S. Chopra, S. Lashkare, Y. Kim, S. Srinivasan, S. Kuppurao, S. Lodha, U. Ganguly","doi":"10.1109/DRC.2012.6256979","DOIUrl":null,"url":null,"abstract":"Resistive RAM is a very promising candidate for high density non-volatile memory. Although bipolar operation has been shown to work at lower current (essential for low power, mobile computing) [1], a suitable selector device that delivers high current density and high on/off current ratio is challenging [2–4]. We demonstrate a 4F2 bipolar selector device based on the punch-through mechanism. An npn vertical junction device fabricated using in-situ doped epitaxial silicon is presented. Superior on-current density (Jon=1MA/cm2) and high on-off current ratio (Ion/Ioff) of 300–5000 is experimentally demonstrated. TCAD simulations based performance, variability and scalability are presented.","PeriodicalId":6808,"journal":{"name":"70th Device Research Conference","volume":"4 1","pages":"115-116"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Epitaxial Si punch-through based selector for bipolar RRAM\",\"authors\":\"P. Bafna, P. Karkare, S. Srinivasan, S. Chopra, S. Lashkare, Y. Kim, S. Srinivasan, S. Kuppurao, S. Lodha, U. Ganguly\",\"doi\":\"10.1109/DRC.2012.6256979\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Resistive RAM is a very promising candidate for high density non-volatile memory. Although bipolar operation has been shown to work at lower current (essential for low power, mobile computing) [1], a suitable selector device that delivers high current density and high on/off current ratio is challenging [2–4]. We demonstrate a 4F2 bipolar selector device based on the punch-through mechanism. An npn vertical junction device fabricated using in-situ doped epitaxial silicon is presented. Superior on-current density (Jon=1MA/cm2) and high on-off current ratio (Ion/Ioff) of 300–5000 is experimentally demonstrated. TCAD simulations based performance, variability and scalability are presented.\",\"PeriodicalId\":6808,\"journal\":{\"name\":\"70th Device Research Conference\",\"volume\":\"4 1\",\"pages\":\"115-116\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"70th Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DRC.2012.6256979\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"70th Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.2012.6256979","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Epitaxial Si punch-through based selector for bipolar RRAM
Resistive RAM is a very promising candidate for high density non-volatile memory. Although bipolar operation has been shown to work at lower current (essential for low power, mobile computing) [1], a suitable selector device that delivers high current density and high on/off current ratio is challenging [2–4]. We demonstrate a 4F2 bipolar selector device based on the punch-through mechanism. An npn vertical junction device fabricated using in-situ doped epitaxial silicon is presented. Superior on-current density (Jon=1MA/cm2) and high on-off current ratio (Ion/Ioff) of 300–5000 is experimentally demonstrated. TCAD simulations based performance, variability and scalability are presented.