基于外延Si穿孔的双极RRAM选择器

P. Bafna, P. Karkare, S. Srinivasan, S. Chopra, S. Lashkare, Y. Kim, S. Srinivasan, S. Kuppurao, S. Lodha, U. Ganguly
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引用次数: 12

摘要

电阻式RAM是一种非常有前途的高密度非易失性存储器。虽然双极操作已被证明可以在较低的电流(对于低功耗、移动计算至关重要)下工作,但一个合适的选择器设备可以提供高电流密度和高通/关电流比,这是一个挑战[2-4]。我们展示了一种基于穿孔机制的4F2双极选择器装置。介绍了一种利用原位掺杂外延硅制备的npn垂直结器件。实验证明了优越的通流密度(Jon=1MA/cm2)和300-5000的高通断电流比(Ion/Ioff)。提出了基于性能、可变性和可扩展性的TCAD仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Epitaxial Si punch-through based selector for bipolar RRAM
Resistive RAM is a very promising candidate for high density non-volatile memory. Although bipolar operation has been shown to work at lower current (essential for low power, mobile computing) [1], a suitable selector device that delivers high current density and high on/off current ratio is challenging [2–4]. We demonstrate a 4F2 bipolar selector device based on the punch-through mechanism. An npn vertical junction device fabricated using in-situ doped epitaxial silicon is presented. Superior on-current density (Jon=1MA/cm2) and high on-off current ratio (Ion/Ioff) of 300–5000 is experimentally demonstrated. TCAD simulations based performance, variability and scalability are presented.
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