用于三维集成应用的Sn/In-Cu互连的低温键合

2013 IEEE International Interconnect Technology Conference - IITC Pub Date : 2013-06-13 DOI:10.1109/IITC.2013.6615572

R. Tzeng, Yan-Pin Huang, Y. Chien, C. Chuang, W. Hwang, J. Chiou, M. Shy, Teu-Hua Lin, Kou-Hua Chen, C. Chiu, H. Tong, Kuan-Neng Chen

{"title":"用于三维集成应用的Sn/In-Cu互连的低温键合","authors":"R. Tzeng, Yan-Pin Huang, Y. Chien, C. Chuang, W. Hwang, J. Chiou, M. Shy, Teu-Hua Lin, Kou-Hua Chen, C. Chiu, H. Tong, Kuan-Neng Chen","doi":"10.1109/IITC.2013.6615572","DOIUrl":null,"url":null,"abstract":"A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.","PeriodicalId":6377,"journal":{"name":"2013 IEEE International Interconnect Technology Conference - IITC","volume":"60 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications\",\"authors\":\"R. Tzeng, Yan-Pin Huang, Y. Chien, C. Chuang, W. Hwang, J. Chiou, M. Shy, Teu-Hua Lin, Kou-Hua Chen, C. Chiu, H. Tong, Kuan-Neng Chen\",\"doi\":\"10.1109/IITC.2013.6615572\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.\",\"PeriodicalId\":6377,\"journal\":{\"name\":\"2013 IEEE International Interconnect Technology Conference - IITC\",\"volume\":\"60 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Interconnect Technology Conference - IITC\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2013.6615572\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Interconnect Technology Conference - IITC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2013.6615572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

摘要

提出并研究了一种Sn/In复合焊料与Cu互连的低温键合工艺。在键合互连中形成的金属间化合物可以在以下过程中很好地存活。在低温下结合的Sn/ in - cu互连都具有优异的电性能和高的耐多重电流应力，在3D应用中显示出巨大的潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2013 IEEE International Interconnect Technology Conference - IITC

自引率

0.00%

发文量