化学气相沉积法制备多层石墨烯互连的电学性能

M. Katagiri, H. Miyazaki, Y. Yamazaki, Li Zhang, Takashi Matsumoto, M. Wada, A. Kajita, T. Sakai
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引用次数: 7

摘要

我们制造了100纳米级线宽的多层石墨烯互连。多层石墨烯采用远程等离子体增强化学气相沉积(CVD)技术在600℃低温下在Ni催化剂层上生长,并在Ni层剥离后转移到SiO2/Si衬底上。CVD石墨烯互连的片电阻低至500 Ω sq。电阻的温度依赖性表明CVD石墨烯具有半金属输运特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical properties of multilayer graphene interconnects prepared by chemical vapor deposition
We fabricate multilayer graphene interconnects with 100-nm-class line widths. Multilayer graphene is grown on a Ni catalyst layer using remote plasma-enhanced chemical vapor deposition (CVD) at a low temperature of 600°C and transferred onto a SiO2/Si substrate after exfoliation from the Ni layer. The sheet resistance of the CVD graphene interconnects is as low as 500 Ω sq. The temperature dependence of resistance reveals that the CVD graphene exhibits half-metallic transport properties.
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