J. Vlček, S. Hřeben, J. Kalaš, J. Čapek, P. Zeman, R. Čerstvý, V. Peřina, Y. Setsuhara
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引用次数: 26
摘要
新型季元Si-B-C-N材料因其在高温和恶劣环境下的应用前景而越来越受到人们的关注。在本研究中,在氮气-氩气混合物中,用单一的C-Si-B或B4C-Si靶材,通过反应直流磁控溅射在Si和SiC衬底上沉积了非晶Si - b - c - n薄膜。在目标侵蚀区域中固定75%的Si含量,rf诱导的负衬底偏置电压为- 100 V,衬底温度为350℃,总压力为0.5 Pa。通过相应的放电和沉积特性(如离子与成膜粒子的通量比、每沉积原子的离子能量和沉积速率)来了解工艺参数与薄膜特性之间的复杂关系。在优化条件下(B4C-Si靶材,50% N2+50% Ar气体混合物)沉积的薄膜,具有Si32-34B9-10C2-4N49-51的成分(in . %),总含水量较低(小于5%)。
Magnetron sputtered Si–B–C–N films with high oxidation resistance and thermal stability in air at temperatures above 1500 °C
Novel quaternary Si–B–C–N materials are becoming increasingly attractive because of their possible high-temperature and harsh-environment applications. In the present work, amorphous Si–B–C–N films were deposited on Si and SiC substrates by reactive dc magnetron cosputtering using a single C–Si–B or B4C–Si target in nitrogen-argon gas mixtures. A fixed 75% Si fraction in the target erosion areas, a rf induced negative substrate bias voltage of −100 V, a substrate temperature of 350 °C, and a total pressure of 0.5 Pa were used in the depositions. The corresponding discharge and deposition characteristics (such as the ion-to-film-forming particle flux ratio, ion energy per deposited atom, and deposition rate) are presented to understand complex relationships between process parameters and film characteristics. Films deposited under optimized conditions (B4C–Si target, 50% N2+50% Ar gas mixture), possessing a composition (in at. %) Si32–34B9–10C2–4N49–51 with a low (less than 5 at. %) total content of hydrog...