剂量率对超浅表面掺杂形态的影响

Shao-Yu Hu, G. Lin, Ching-I Li, Hong Lu, Z. Wan
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引用次数: 0

摘要

由于剂量率对半导体器件性能的影响,在离子注入史上被广泛研究。几个主要参数可以通过剂量率调整,包括植入物损伤、掺杂分布和掺杂激活。随着器件尺寸的缩小,超浅表面掺杂对器件性能的影响越来越大。本文研究了硼的一种特殊分布现象。剂量率调节的一些参数也被用来调节表面轮廓,这是潜在的调节装置性能改进的旋钮。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The influence of dose rate on ultra shallow surface dopant profile
Dose rates were widely studied in ion implanter history due to the influence on semiconductor device performance. Several major parameters can be adjusted by dose rate, including implant damage, doping profile distribution, and doping activation. As devices shrink, ultra shallow surface doping becomes more significant on device performance. In this study, a special phenomenon of Boron distribution was investigated. Some parameters for dose rate tuning were also used to adjust the surface profile, which were potentially knobs for tuning device performance improvement.
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