5G/毫米波应用的超薄玻璃板嵌入式(GPE)封装与片状环氧成型化合物的首次演示

N. Ogura, Siddharth Ravichandran, Tailong Shi, A. Watanabe, Shuhei Yamada, M. Kathaperumal, R. Tummala
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引用次数: 3

摘要

随着连接设备数量的急剧增加,5G/毫米波(MMW)技术的通信数据速率预计将至少达到10 - 100倍,远高于现有的4G LTE连接。[1],[2]为了跟上这一趋势,需要毫米波频率范围内的新型封装技术,这将解决毫米波的基本技术挑战,如高介电损耗、无源质量因子的退化、寄生增加、电磁干扰急剧增强以及天线阵列辐射效率降低。目前正在研究的最先进的方法包括具有低介电常数(Dk)和低耗散因子(Df)的有机核心衬底,如氟基或液晶聚合物(LCP)衬底,以实现增强的天线性能和低信号耗散。然而,这些基于有机基板的技术既不能使封装小型化,也不能处理实现高密度封装的精确信号路由。为了应对这些挑战,人们将注意力集中在扇出晶圆级封装(FOWLP)技术上,如eWLB、InFO和SWIFT,这些技术将集成电路(ic)嵌入到环氧树脂成型化合物中。[3] -[6]最近,玻璃嵌板(GPE)技术正在成为一种理想的封装方法,它具有优异的性能以及小尺寸、超低损耗、高密度、超短互连和低成本。[7]这些好处源于使用玻璃的优点,它具有优异的性能,如精密再分配层(RDL)的超光滑表面,面板可扩展性的特殊尺寸稳定性和CTE的可定制性,允许直接贴板以提高系统性能。此外,利用环氧树脂成型化合物作为封装材料,可以使GPE封装更薄,更坚固,封装面积小。玻璃腔板的成型也有助于超薄玻璃的处理,超薄玻璃被视为生产中玻璃基包装解决方案的瓶颈。这有利于提高吞吐量,允许更多的空腔切割(更多的票)每个面板。本文首次展示了用于5G/毫米波应用的超薄GPE与片状环氧成型化合物(SMC)。本文第一部分讨论了夹层SMC嵌入玻璃面板的工艺流程,包括芯片在玻璃腔中的放置,SMC的层压,以及封装结构的可靠性。本文报道了在厚度为40 μm的60 μm玻璃基板上进行的实验。本文第二部分重点介绍了5G/毫米波应用的低损耗互连,并介绍了rdl中的传输线和微通孔等信号路由的工艺发展,以及具有孔中孔工艺的通封装通孔(TPVs)。结果表明,超薄GPE架构是一种很有前途的封装技术解决方案,适用于包括高频通信和高性能计算在内的各种应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications
With the number of connected-devices increasing tremendously, communication data rates are projected to be at least 10–100X in the 5G/mm-wave (MMW) technology - much higher than the existing 4G LTE connections.[1], [2] To catch up with the trend, novel packaging technology in the MMW frequency range is required, which will address fundamental MMW technical challenges such as high dielectric loss, degradation of quality factors in passives, increased parasitic, dramatically-enhanced electromagnetic interference, and the reduced radiation efficiency of antenna arrays. State-of-the-art approaches being pursued include organic-core substrates that have a low dielectric constant (Dk) and low dissipation factor (Df) such as fluorine based or liquid-crystal polymer (LCP) substrates in order to achieve enhanced antenna performance and low signal dissipations. These organic-based substrate technologies, however, can neither miniaturize packages nor handle precision signal routings that enable high density packages. To address these challenges, attention is focused on Fan-Out Wafer Level Package (FOWLP) technologies, like eWLB, InFO, and SWIFT, where integrated circuits (ICs) are embedded in epoxy molding compound. [3]–[6] Recently, glass-panel embedding (GPE) technology is emerging as an ideal packaging methodology that enables superior performance along with small form factor, ultra-low-loss, high density, ultra-short interconnects, and low cost. [7] These benefits stem from the advantages of using glass which has excellent properties such as ultra-smooth surface for precision redistribution layer (RDL), exceptional dimensional stability for panel-scalability and tailorability of CTE that allow direct board-attach for improved system performance. In addition, utilizing the epoxy molding compounds as encapsulation material allows the GPE package to be thinner and more robust package with small farm factor. Molding of glass cavity panels also helps with the handling of ultra-thin glass which is seen as a bottleneck towards glass based packaging solutions in production. These facilitates enhanced throughput by allowing more cavity cut outs (more coupons) per panel. This paper presents the first demonstration of ultra-thin GPE with sheet type epoxy molding compound (SMC) for 5G/mm-wave applications. First part of this paper discusses the process-flow used in glass-panel embedding with laminated SMC, including chip placement in glass cavities, lamination of SMC, and the reliability of the package architecture. This paper reports on such a demonstration in 60 μm glass substrates with 40 μm thickness SMC. The second part of this paper focuses on low-loss interconnects for 5G/mm-wave applications and presents the process development of signal routings such as transmission lines and microvias in RDLs as well as through-package vias (TPVs) with via-in-via process. The results suggest that the ultra-thin GPE architecture is a promising packaging technology solution for a variety of applications including high-frequency communications and high-performance computing.
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