液相外延法在异形InP表面生长InP/InGaAsP异质结构外延层

M. G. Vasil’ev, A. M. Vasil’ev, A. D. Izotov, Yu. O. Kostin, A. Shelyakin
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引用次数: 2

摘要

研究了液相外延法在异形InP衬底上生长外延层时不同平面的影响。这些研究使得在InP/InGaAsP系统中获得埋藏异质结构成为可能,并创造了高效的激光二极管和图像传感器。研究发现,通过选择相应的蚀刻剂、条带取向和获得掩膜涂层的方法,可以得到由{111}А、{111}B、{110}、{112}A或{221}A族平面形成的沟道形式的突出台面条或深度台面条。有人指出,在轴的极性与的方向相同的情况下,台面条的切割是沿着包装最密集的平面进行的。这种切割导致了化学蚀刻和外延埋的异型表面的速率的差异。切割沿平面以低溶解速率{111}a对闪锌矿晶格进行,所研究的材料磷化铟属于闪锌矿晶格。对平面{110}和{Ī10}的分析表明,最密集的平面{111}A和{111}B相对于它们的位置是不同的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Growing epitaxial layers of InP/InGaAsP heterostructures on the profiled InP surfaces by liquid-phase epitaxy
The effect of various planes was studied when growing epitaxial layers by liquid-phase epitaxy (LPE) on the profiled InP substrates. The studies allowed obtaining buried heterostructures in the InP/InGaAsP system and creating highly efficient laser diodes and image sensors.It was found that protruding mesa strips or in-depth mesa strips in the form of channels formed by the {111}А, {111}B, {110}, {112}A, or {221}A family of planes can be obtained with the corresponding selection of an etching agent, strip orientation, and a method of obtaining a masking coating. It was noted that in the case of the polarity of axes being in the direction of <111>, the cut of mesa strips was conducted along the most densely packaged planes. This cut led to the difference in rates of both chemical etching and epitaxial burying of profiled surfaces.The cut was made along the planes at a low dissolution rate {111}A for a sphalerite lattice, to which the studied material, indium phosphide, belongs. Analysis of planes {110} and {Ī10} showed that the location of the most densely packaged planes {111}A and {111}B relative to them is different.
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