通用NBTI紧凑型模型从单次长期直流测量中复制AC应力/恢复

Q4 Engineering
Takumi Hosaka, S. Nishizawa, Ryo Kishida, Takashi Matsumoto, Kazutoshi Kobayashi
{"title":"通用NBTI紧凑型模型从单次长期直流测量中复制AC应力/恢复","authors":"Takumi Hosaka, S. Nishizawa, Ryo Kishida, Takashi Matsumoto, Kazutoshi Kobayashi","doi":"10.2197/ipsjtsldm.13.56","DOIUrl":null,"url":null,"abstract":"In this paper, a simple and compact Negative Bias Temperature Instability (NBTI) model is proposed. It is based on the reaction-diffusion (tn) and hole-trapping (log(t)) theories. A single shot of DC stress and recovery data is utilized to express duty cycle dependence of NBTI degradation and recovery. Parameter fitting is proceeded by considering that the amount of recovery cannot be larger than stress degradation. The proposed universal model is applied to two types of transistors in different fabrication process technologies, and evaluate its feasibility to show the universality of our proposed model. It replicates stress and recovery successfully with various duty cycles.","PeriodicalId":38964,"journal":{"name":"IPSJ Transactions on System LSI Design Methodology","volume":"1 1","pages":"56-64"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Universal NBTI Compact Model Replicating AC Stress/Recovery from a Single-shot Long-term DC Measurement\",\"authors\":\"Takumi Hosaka, S. Nishizawa, Ryo Kishida, Takashi Matsumoto, Kazutoshi Kobayashi\",\"doi\":\"10.2197/ipsjtsldm.13.56\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a simple and compact Negative Bias Temperature Instability (NBTI) model is proposed. It is based on the reaction-diffusion (tn) and hole-trapping (log(t)) theories. A single shot of DC stress and recovery data is utilized to express duty cycle dependence of NBTI degradation and recovery. Parameter fitting is proceeded by considering that the amount of recovery cannot be larger than stress degradation. The proposed universal model is applied to two types of transistors in different fabrication process technologies, and evaluate its feasibility to show the universality of our proposed model. It replicates stress and recovery successfully with various duty cycles.\",\"PeriodicalId\":38964,\"journal\":{\"name\":\"IPSJ Transactions on System LSI Design Methodology\",\"volume\":\"1 1\",\"pages\":\"56-64\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IPSJ Transactions on System LSI Design Methodology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2197/ipsjtsldm.13.56\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IPSJ Transactions on System LSI Design Methodology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2197/ipsjtsldm.13.56","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

摘要

本文提出了一种简单紧凑的负偏置温度不稳定性(NBTI)模型。它是基于反应扩散(tn)和空穴捕获(log(t))理论。利用单次直流应力和恢复数据来表示NBTI退化和恢复的占空比依赖关系。考虑到恢复量不能大于应力退化量,进行参数拟合。将所提出的通用模型应用于两种不同制造工艺的晶体管,并对其可行性进行了评估,以证明所提出模型的通用性。它在不同的占空比下成功地复制了压力和恢复。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Universal NBTI Compact Model Replicating AC Stress/Recovery from a Single-shot Long-term DC Measurement
In this paper, a simple and compact Negative Bias Temperature Instability (NBTI) model is proposed. It is based on the reaction-diffusion (tn) and hole-trapping (log(t)) theories. A single shot of DC stress and recovery data is utilized to express duty cycle dependence of NBTI degradation and recovery. Parameter fitting is proceeded by considering that the amount of recovery cannot be larger than stress degradation. The proposed universal model is applied to two types of transistors in different fabrication process technologies, and evaluate its feasibility to show the universality of our proposed model. It replicates stress and recovery successfully with various duty cycles.
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来源期刊
IPSJ Transactions on System LSI Design Methodology
IPSJ Transactions on System LSI Design Methodology Engineering-Electrical and Electronic Engineering
CiteScore
1.20
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0.00%
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