倒装芯片设计的全局路由和跟踪分配

Xiaodong Liu, Yifan Zhang, G. Yeap, Chunlei Chu, Jian Sun, Xuan Zeng
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引用次数: 15

摘要

本文提出了一种倒装I/O网络全局路由和轨迹分配的解决方案。利用Voronoi图(VD)对开放路由空间进行划分,并利用VD图的几何特性创建考虑容量和拥塞的全局路由通道。采用网络流算法实现全局最优路由。观察到倒装芯片凹凸放置的规律性,使我们能够将全局路由通道图的大小减少50%以上,从而加快计算速度。航迹分配算法避免了在详细路由完成最终路由之前交叉布线。使用实际硅芯片数据的实验结果表明,与商业工具中使用的实现相比,我们的解决方案获得了良好的结果质量。类别和主题描述:B.7.2[集成电路]:设计辅助工具-布局、放置和布线
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Global routing and track assignment for flip-chip designs
This paper describes a solution for global routing and track assignment of flip-chip I/O nets. Voronoi Diagram (VD) is used to partition the open routing space and the geometrical properties of VD graph are exploited to create global routing channels with capacity and congestion considerations. A network flow algorithm is used to achieve optimal global routing. The regularity of the flip-chip bump placement is observed and allows us to reduce the size of global routing channel graph by over 50% to speed up computation. A track assignment algorithm avoids crossing wires before completing the final route with a detailed router. Experiment results using actual silicon chip data demonstrate that our solution achieves good quality of results compared to an implementation used in a commercial tool. Categories and Subject Descriptors: B.7.2 [Integrated Circuits]: Design Aids — Layout, Placement and Routing General Terms: Algorithms, Design
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