先进封装用晶圆涂层材料最新技术

Ryuji Hirosawa, Junya Kusunoki
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引用次数: 0

摘要

近年来,随着智能手机等电子设备的功能越来越强大、结构越来越紧凑、成本越来越低,许多半导体制造商正在研究具有再分配层(RDL)的WLP(晶圆级封装)等封装。随着半导体封装的小型化和引脚数的增加,半导体芯片与外部电极之间的传导方式已经从导线连接转变为凹凸连接和RDL。而晶圆涂层材料的应用也要求具有更高的功能,从缓冲涂层膜到碰撞保护,再到RDL的层间绝缘膜。此外,近年来,除了为了避免半导体器件因高温处理而性能下降外,FOWLP中有时会使用耐热性较低的封装材料,因此要求晶圆涂层材料具有低温固化性。我们通过缩短PBO前驱体中羟基与羰基之间的距离,研制出一种可以低温固化的PBO。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Latest technology of wafer coating material for advanced packages
In recent years, as electronic devices such as smartphones become more functional, more compact, and lower cost, many semiconductor makers are studying the packages such as WLP (Wafer Level Package) having re-distribution layer (RDL).With the miniaturization and the increase in the number of pins of a semiconductor package, the method of conduction between a semiconductor chip and an external electrode has been changed from wire connection to bump connection and RDL. And the application of a wafer coating material is also required to have higher functions from a buffer coat film to bump protection and an interlayer insulating film for RDL. Further, in recent years, in addition to the purpose of avoiding the performance deterioration of the semiconductor device due to the high-temperature treatment, a package material having low heat resistance is sometimes used in the FOWLP, and therefore, the wafer coating material is required to lower temperature curable. We have developed a PBO that can be cured at low temperature by shortening the distance between hydroxyl group and carbonyl group in the PBO precursor.
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