紧凑的建模透视-桥梁到工业应用

2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Pub Date : 2019-09-01 DOI:10.1109/SISPAD.2019.8870471

M. Miura-Mattausch

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引用次数: 2

摘要

本文简要总结了紧凑模型的发展历史，其特点是演变为器件和电路之间的桥梁。结果表明，通过考虑紧凑模型中器件现象的微观特征，可以实现精确预测电路性能的任务，而以前只能从宏观上进行处理。

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Compact Modeling Perspetive – Bridge to Industrial Applications

This paper summarizes briefly compact-model development history, which is characterized by the evolution into the role as a bridge between devices and circuits. It is demonstrated that the task of predicting circuitry performance accurately has been realized by considering the microscopic features of the device phenomena in the compact model, which had been previously treated only macroscopically.

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来源期刊

2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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