2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - 最新文献

Effect of Stacking Faults on the Thermoelectric Figure of Merit of Si Nanowires

Pub Date : 2019-10-17 DOI: 10.1109/SISPAD.2019.8870535 K. Vuttivorakulchai, M. Luisier, A. Schenk

Effect of Trap on Carrier Transport in InAs FET with Al2 O3 Oxide: DFT-based NEGF simulations

Pub Date : 2019-09-05 DOI: 10.1109/SISPAD.2019.8870567 M. Shin, Yucheol Cho, S. Jeon

Defect creation and Diffusion under electric fields from first-principles: the prototypical case of silicon dioxide

Pub Date : 2019-09-04 DOI: 10.1109/SISPAD.2019.8870555 N. Salles, L. Martin-Samos, Stefano de Gironcoli, L. Giacomazzi, M. Valant, A. Hémeryck, P. Blaise, B. Sklénard, N. Richard

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