PSPI暴露过程中DHP温度效应的研究

Doyoung Kim, Kyung-Sek Song, Chankyun Kim, S. Lee
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引用次数: 0

摘要

PSPI已应用于晶圆末端工艺,以提高效率。然而,它会导致处理时间增加,这在照相过程中可能是一个严重的问题。曝光时间过长会导致效率和生产率降低。它还被指责损坏了昂贵的设备镜头。现有的对策还没有解决这些问题。作为替代方案,DHP温度控制有望通过调整PSPI的硬度来减少曝光时间。因此,每个镜头的曝光时间可以大幅减少,提高了许多镜头反复曝光在晶圆片上的照片工艺的生产率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on DHP temperature effect in PSPI exposure process
PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipment lens. Existing countermeasures have yet to clear those problems. As an alternative, DHP temperature control is expected to reduce exposure time by adjusting the hardness of PSPI. Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.
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